CONDUCTIVE PATTERN FILM AND ITS BONDING METHOD

A bonding method of a conductive pattern film improving the uniformity of the conductivity of junction and reliability is provided to form solder interconnection by using the longitudinal direction ultrasonic wave or the micro heater. A conductive pattern film(100) comprises a machine parts area(110...

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Bibliographische Detailangaben
Hauptverfasser:	YOO, CHOONG DON, KIM, SUN RAK, LEE, JAE HAK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A bonding method of a conductive pattern film improving the uniformity of the conductivity of junction and reliability is provided to form solder interconnection by using the longitudinal direction ultrasonic wave or the micro heater. A conductive pattern film(100) comprises a machine parts area(110) having a plurality of penetration holes(120). A conductive pattern unit(130) is formed in the wall of the penetration hole and circumference of entry of the penetration hole. A solder unit is filled with the central part of the penetration hole. The machine parts area is the polymer film having a plurality of penetration holes. The solder land is the swollen solder bump to the top and lower part of the penetration hole.