ADHESIVE CHUCK, APPARATUS AND METHOD FOR ATTACHING SUBSTRATES USING THE SAME

A substrate laminating apparatus and a substrate bonding method canceling the problem that smudge is generated on the display panel are provided to laminate the substrate in a state that the alignment of the substrate is maintained stably. A guide groove is formed in a lower-part of a supporting pla...

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1. Verfasser: HA, JOO IL
Format: Patent
Sprache:eng
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Zusammenfassung:A substrate laminating apparatus and a substrate bonding method canceling the problem that smudge is generated on the display panel are provided to laminate the substrate in a state that the alignment of the substrate is maintained stably. A guide groove is formed in a lower-part of a supporting plate(114). An adhesion plate(115) is arranged in the downward of the supporting plate. A slide shoe slid according to the guide groove is formed on the upper side of the adhesion plate. Adhesion projections adhered to the inter-molecular attraction in the substrate are formed on the lower-part of the adhesion plate. A horizontal movement device passes through the supporting plate and adhesion plate. The outer edge portion of the horizontal shifter contacts in the supporting plate and adhesion plate.