CHIP BONDING SYSTEM

CHIP BONDING SYSTEM

A chip bonding system is provided to improve the availability of the space by laminating the other chip on the bonded chip. The first conveying unit transfers the lead frame along the guide unit(100). The pre baker(500) is installed at the side of the frame feeding unit(310) and melts the resin coat...

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1. Verfasser: KANG, BYUNG HWAN
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KANG, BYUNG HWAN
description A chip bonding system is provided to improve the availability of the space by laminating the other chip on the bonded chip. The first conveying unit transfers the lead frame along the guide unit(100). The pre baker(500) is installed at the side of the frame feeding unit(310) and melts the resin coated the lead frame. The second conveying unit(600) supplies the lead frame of the frame feeding unit to pre baker and tranfers the lead frame to the guide unit. The tape attachment unit(700) attaches the adhesive tape in the lead frame transferred along the guide unit or the chip bonded in the grid frame. The dispenser [dispenser](800) sprays selectively resin along the guide unit. The chip transfer(1300) delivers the chip of the chip feeding unit to the second bonding unit.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CHIP BONDING SYSTEM
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