CHIP BONDING SYSTEM

A chip bonding system is provided to improve the availability of the space by laminating the other chip on the bonded chip. The first conveying unit transfers the lead frame along the guide unit(100). The pre baker(500) is installed at the side of the frame feeding unit(310) and melts the resin coat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KANG, BYUNG HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A chip bonding system is provided to improve the availability of the space by laminating the other chip on the bonded chip. The first conveying unit transfers the lead frame along the guide unit(100). The pre baker(500) is installed at the side of the frame feeding unit(310) and melts the resin coated the lead frame. The second conveying unit(600) supplies the lead frame of the frame feeding unit to pre baker and tranfers the lead frame to the guide unit. The tape attachment unit(700) attaches the adhesive tape in the lead frame transferred along the guide unit or the chip bonded in the grid frame. The dispenser [dispenser](800) sprays selectively resin along the guide unit. The chip transfer(1300) delivers the chip of the chip feeding unit to the second bonding unit.