LATENT CURING AGENT

Disclosed is an aluminum chelate-based latent curing agent which is capable of curing a thermosetting epoxy resin at a relatively low temperature in a short time. The aluminum chelate-based latent curing agent is obtained by reacting an aluminum chelating agent with a silsesquioxane type oxethane de...

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Bibliographische Detailangaben
Hauptverfasser:	KAWASHIMA TADASU, ITO MASAHIKO, MASUKO DAISUKE, KOMURO KATSUHIKO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Disclosed is an aluminum chelate-based latent curing agent which is capable of curing a thermosetting epoxy resin at a relatively low temperature in a short time. The aluminum chelate-based latent curing agent is obtained by reacting an aluminum chelating agent with a silsesquioxane type oxethane derivative in the presence of an alicyclic epoxy compound, and then making the resulting latent by reacting a liquid epoxy resin with an imidazole compound or reacting an aromatic vinyl compound with a radical polymerization initiator.