WHEEL FOR GRINDING CIRCUMFERENTIAL SURFACE OF SILICON INGOT

WHEEL FOR GRINDING CIRCUMFERENTIAL SURFACE OF SILICON INGOT

A wheel for grinding the outer circumference of a silicon ingot is provided to improve productivity by reducing the time and the number of grinding the outer circumference of the silicon ingot as the contact area of the silicon ingot is broadened. A wheel(100) for grinding the outer circumference of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NA, GWANG HA, CHAE, JONG WOOK, HA, SE GEUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:A wheel for grinding the outer circumference of a silicon ingot is provided to improve productivity by reducing the time and the number of grinding the outer circumference of the silicon ingot as the contact area of the silicon ingot is broadened. A wheel(100) for grinding the outer circumference of a silicon ingot comprises a shank(110), and a plurality of electrodeposition parts(120). In the shank, a coupling hole(112) coupled with a spindle is formed. A plurality of electrodeposition parts are formed at the front side of the shank to have different diameters and diamond abrasive-grain are respectively attached to the electrodeposition parts. The particle sizes of the diamond abrasive-grain of a plurality of electrodeposition part are different according to a plurality of electrodeposition parts.