ADHESIVE BONDING SHEET

Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains (A) a high- molecular-weight component containing a functional...

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Bibliographische Detailangaben
Hauptverfasser:	INADA TEIICHI, OOKUBO KEISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains (A) a high- molecular-weight component containing a functional group which has a weight average molecular weight of not less than 100,000; (B) an epoxy resin; (C) a phenol epoxy resin curing agent; (D) a photoreactive monomer whose cured product obtained by being irradiated with ultraviolet light has a Tg of not less than 250°C; and (E) a photoinitiator which generates bases and radicals when irradiated with ultraviolet light having a wavelength of 200-450 nm.