RESIN COMPOSITION FOR LENS AND CURED PRODUCT THEREOF

A resin composition for lens is provided to ensure heat resistance which can endure solder reflow and to mold lens with low absorption, high transparency and low thermal expansibility. A resin composition for lens comprises (A) box-type silsesquioxane having at least two aliphatic unsaturated bonds...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI KEIICHI, KAWATANI TOSHIHIRO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A resin composition for lens is provided to ensure heat resistance which can endure solder reflow and to mold lens with low absorption, high transparency and low thermal expansibility. A resin composition for lens comprises (A) box-type silsesquioxane having at least two aliphatic unsaturated bonds in one molecule; (B) organohydrogenpolysiloxane having at least two SiH grops in one molecule; (C) an ethylenically unsaturated compound having at least two (meth)acryl groups in one molecule; and (D) a curing catalyst. The ratio of the number of the aliphatic unsaturated bonding groups of (A) component and the SiH group of (B) component is 1:0.1~2.0.