HEAT RADIATING PLATE FOR SEMICONDUCTOR PACKAGE AND PLATING METHOD THEREOF

A heat radiating plate for semiconductor package and a plating method thereof are provided to reduce a manufacturing cost by plating the minimum amount of gold thereon. A heat radiating plate(10) for semiconductor package includes a concave part(15), a stepped part(18a), and a plating part. The conc...

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Bibliographische Detailangaben

1. Verfasser:	NEGORO SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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