HEAT RADIATING PLATE FOR SEMICONDUCTOR PACKAGE AND PLATING METHOD THEREOF

HEAT RADIATING PLATE FOR SEMICONDUCTOR PACKAGE AND PLATING METHOD THEREOF

A heat radiating plate for semiconductor package and a plating method thereof are provided to reduce a manufacturing cost by plating the minimum amount of gold thereon. A heat radiating plate(10) for semiconductor package includes a concave part(15), a stepped part(18a), and a plating part. The conc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: NEGORO SHUJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A heat radiating plate for semiconductor package and a plating method thereof are provided to reduce a manufacturing cost by plating the minimum amount of gold thereon. A heat radiating plate(10) for semiconductor package includes a concave part(15), a stepped part(18a), and a plating part. The concave part is formed on a surface of the heating radiating plate. The concave part includes an inner bottom portion(16) and an inner wall portion(18). The stepped part is formed on the inner wall portion of the concave part. The plating part is formed on the inner wall portion of the concave part. The plating part is used for coating an entire surface of the inner bottom portion of the concave part. The plating part is composed of gold. The heat radiating plate has a rectangular shape.