EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor manufacturing system is provided to increase or maximize a production yield by preventing defects in a semiconductor manufacturing process due to an overheating effect of an outer top electrode. A semiconductor manufacturing system includes a reaction chamber(120), an electrostatic chuck(130), a bottom electrode(140), an inner top electrode(160), and an outer top electrode(170). The reaction chamber provides a space sealed from the outside. The electrostatic chuck supports a wafer at a lower part of the reaction chamber. The first RF power is applied from a lower part of the electrostatic chuck to the bottom electrode. The inner top electrode injects a reaction gas at an upper end of the reaction chamber facing the lower electrode and the electrostatic chuck. The inner top electrode receives the second RF power to excite the reaction gas in a plasma state. The outer top electrode minimizes an influence caused by the RF power for concentrating the reaction gas of the plasma state on an upper part of the wafer. The outer top electrode is etched by the reaction gas. The outer top electrode is formed with one body in order to prevent generation of particles.