3D ELECTRONIC PACKAGING STRUCTURE HAVING A CONDUCTIVE SUPPORT SUBSTRATE

A 3D electronic packaging structure having a conductive supporting substrate is provided to improve electrical performance of an electronic element by performing a signal transmitting function and a grounding terminal function. An electronic packaging structure includes a conductive supporting substrate(320), a charging area, signal contacts(320c, 325), and signal channels(320a, 320b). An electronic element(301) is arranged on a surface of the conductive supporting substrate. The area of the conductive supporting substrate is bigger than or equal to or smaller than the area of the electronic element. The charging area is formed around the electric element. One or more via hole(311) is formed in the inside of the charging area. The via hole or a hole is filled with a conductive material. A surface of the charging area is connected with the conductive supporting substrate through a signal. The signal contacts are formed at one or more side of the electronic packaging structure. A surface area of the signal contact is larger than or equal to or smaller than an upper surface area of the electronic element. The signal channels are formed at one or more side of the electronic packaging structure. The signal channels are connected with the signal contacts in order to form channels.