SEMICONDUCTOR PACKAGE

A semiconductor package is provided to mount a semiconductor chip in a stable state by surrounding the semiconductor chip by using a resin material. A terminal is arranged on a mount region which is formed on an upper surface of a substrate(120). A semiconductor chip is loaded on the substrate through solder balls(112). The solder balls are loaded on the terminal of the substrate. A plurality of insulating layers(122) and a plurality of internal wiring layers(124) are alternately laminated on the substrate. The insulating layers are made of insulators. Internal circuits are arranged in the internal wiring layers. The terminal is connected with the internal wiring layers through a conductive via. A resin material for filling a gap is formed between the semiconductor chip and the substrate.