DEVICE FOR AUTOMATICALLY FOCUSING A LENS OF A CAMERA IN BONDING MACHINE

An automatic camera focus control apparatus of bonding equipment is provided to determines easily a bonding state by displaying correctly a bonding state between a chip and an inspection target boned with the chip, on a monitor. An automatic camera focus control apparatus of bonding equipment includ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KANG, BYUNG HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING
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Beschreibung
Zusammenfassung:	An automatic camera focus control apparatus of bonding equipment is provided to determines easily a bonding state by displaying correctly a bonding state between a chip and an inspection target boned with the chip, on a monitor. An automatic camera focus control apparatus of bonding equipment includes a guide unit(10), a camera(130), a position sensor(170), and a camera driving unit. The guide unit performs a guiding operation to transfer an inspection target boned with a chip. The camera focuses a bonding part of the inspection target. The position sensor measures a distance from the inspection target boned with the chip. The camera driving unit adjusts a focal distance of the camera on the basis of the distance measured by the position sensor.