METHOD FOR SEALING CERAMIC PACKAGE

A method for sealing a ceramic package is provided to stably seal a cavity by using a single lead on a substrate in which a plurality of ceramic packages having the cavity is formed. A ceramic main body having a cavity(132) is loaded in a groove included in a bottom jig(110) in which a substrate(130...

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Bibliographische Detailangaben
1. Verfasser:	YASUDA KATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for sealing a ceramic package is provided to stably seal a cavity by using a single lead on a substrate in which a plurality of ceramic packages having the cavity is formed. A ceramic main body having a cavity(132) is loaded in a groove included in a bottom jig(110) in which a substrate(130) is formed. A lead(140) is positioned on a top part of the substrate. A top jig(120) covers the lead. The ceramic main body is sealed by bonding the substrate and the lead through glue(142) molten by a heating source generated by applying a power source to the bottom jig.