AG-BASED SPUTTERING TARGET

An Ag-based sputtering target is provided to form an Ag-based thin film with uniform thickness and small deviation of grain size. An Ag-based sputtering target is made of pure Ag or Ag alloy, having a sputtering surface whose average grain diameter is 10mum or less. The average grain diameter is mea...

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Bibliographische Detailangaben
1. Verfasser:	MATSUZAKI HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An Ag-based sputtering target is provided to form an Ag-based thin film with uniform thickness and small deviation of grain size. An Ag-based sputtering target is made of pure Ag or Ag alloy, having a sputtering surface whose average grain diameter is 10mum or less. The average grain diameter is measured by selecting several points in the sputtering surface and taking the microphotographs of the selected points. The grain diameters observed in all the microphotographs are calculated after photographing. Four or more straight lines are drawn in the shape of # or in a radial form on each microphotograph and the number of grain systems on the straight lines is observed, and then the grain diameter of each straight line is calculated. The Ag alloy contains at least one selected from a group consisting of Nd, Bi, Au and Cu.