SEMICONDUCTOR POWER MODULE PACKAGE WITH TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR POWER MODULE PACKAGE WITH TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME

A semiconductor power module package with a temperature sensor mounted thereon and a method of fabricating the same are provided to sense the temperature of power semiconductor accurately by mounting a thermistor on the semiconductor chip directly before forming a sealing member. Semiconductor chips...

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1. Verfasser: LEE, KEUN HYUK
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE, KEUN HYUK
description A semiconductor power module package with a temperature sensor mounted thereon and a method of fabricating the same are provided to sense the temperature of power semiconductor accurately by mounting a thermistor on the semiconductor chip directly before forming a sealing member. Semiconductor chips(121,125) are arranged on the top of a substrate(110), and a thermo-sensitive device(130) is mounted on the top of at least one semiconductor chip among semiconductor chips. Leads(171,175,176) are electrically connected to semiconductor chips and a thermo-sensitive device. A sealing unit(190) exposes parts of leads and rear side of the substrate and covers the top of the substrate, the semiconductor chips, and the thermo-sensitive device. The thermo-sensitive device more includes a first electrode terminal and a second electrode terminal connected to the leads.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR POWER MODULE PACKAGE WITH TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME
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