SEMICONDUCTOR POWER MODULE PACKAGE WITH TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME

A semiconductor power module package with a temperature sensor mounted thereon and a method of fabricating the same are provided to sense the temperature of power semiconductor accurately by mounting a thermistor on the semiconductor chip directly before forming a sealing member. Semiconductor chips(121,125) are arranged on the top of a substrate(110), and a thermo-sensitive device(130) is mounted on the top of at least one semiconductor chip among semiconductor chips. Leads(171,175,176) are electrically connected to semiconductor chips and a thermo-sensitive device. A sealing unit(190) exposes parts of leads and rear side of the substrate and covers the top of the substrate, the semiconductor chips, and the thermo-sensitive device. The thermo-sensitive device more includes a first electrode terminal and a second electrode terminal connected to the leads.