UNDERFILL HYBRID EPOXY COMPOSITIONS HAVING IMPROVED MOISTURE RESISTANCE AND FLUIDITY

UNDERFILL HYBRID EPOXY COMPOSITIONS HAVING IMPROVED MOISTURE RESISTANCE AND FLUIDITY

An underfill hybrid epoxy composition is provided to rapidly fill an underfill space within a semiconductor device due to excellent fluidity and to improve the reliability of package due to excellent wet-proof property. An underfill hybrid epoxy composition comprises (a) an epoxy resin having at lea...

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Hauptverfasser: SEO, YONG JOO, KIM, JEONG SEOB, JI, SEUNG YONG, LEE, SUN AH
Format: Patent
Sprache:eng
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CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator SEO, YONG JOO
KIM, JEONG SEOB
JI, SEUNG YONG
LEE, SUN AH
description An underfill hybrid epoxy composition is provided to rapidly fill an underfill space within a semiconductor device due to excellent fluidity and to improve the reliability of package due to excellent wet-proof property. An underfill hybrid epoxy composition comprises (a) an epoxy resin having at least two glycidyl groups; (b) a hybrid epoxy resin bonded with siloxane; (c) acid anhydride, siloxane anhydride, silyl anhydride or their mixture as a hardener; and (d) a curing accelerator. The hybrid epoxy resin bonded with siloxane has a structure represented by chemical formula 1: -(E)m-(S)n-, wherein E shows an epoxy group; S shows siloxane; and m and n are an integer of 1-100.
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title UNDERFILL HYBRID EPOXY COMPOSITIONS HAVING IMPROVED MOISTURE RESISTANCE AND FLUIDITY
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