UNDERFILL HYBRID EPOXY COMPOSITIONS HAVING IMPROVED MOISTURE RESISTANCE AND FLUIDITY

An underfill hybrid epoxy composition is provided to rapidly fill an underfill space within a semiconductor device due to excellent fluidity and to improve the reliability of package due to excellent wet-proof property. An underfill hybrid epoxy composition comprises (a) an epoxy resin having at lea...

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Bibliographische Detailangaben
Hauptverfasser:	SEO, YONG JOO, KIM, JEONG SEOB, JI, SEUNG YONG, LEE, SUN AH
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	An underfill hybrid epoxy composition is provided to rapidly fill an underfill space within a semiconductor device due to excellent fluidity and to improve the reliability of package due to excellent wet-proof property. An underfill hybrid epoxy composition comprises (a) an epoxy resin having at least two glycidyl groups; (b) a hybrid epoxy resin bonded with siloxane; (c) acid anhydride, siloxane anhydride, silyl anhydride or their mixture as a hardener; and (d) a curing accelerator. The hybrid epoxy resin bonded with siloxane has a structure represented by chemical formula 1: -(E)m-(S)n-, wherein E shows an epoxy group; S shows siloxane; and m and n are an integer of 1-100.