RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Disclosed is a resin paste for die bonding, which contains a polyurethane imide resin represented by the general formula (I) below, a thermosetting resin, a filler and a solvent for printing. [chemical formula 1] (I) (In the formula, R1 represents a divalent organic group containing an aromatic ring...

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Bibliographische Detailangaben
Hauptverfasser:	MORI SYUICHI, SUGIURA MINORU, HASEGAWA YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is a resin paste for die bonding, which contains a polyurethane imide resin represented by the general formula (I) below, a thermosetting resin, a filler and a solvent for printing. [chemical formula 1] (I) (In the formula, R1 represents a divalent organic group containing an aromatic ring or an aliphatic ring; R2 represents a divalent organic group having a molecular weight of 100-10,000; R3 represents a tetravalent organic group containing 4 or more carbon atoms; and n and m independently represent an integer of 1-100.)