METHOD OF MAKING THERMALLY ENHANCED SUBSTRATE-BASED ARRAY PACKAGE

An array-type package (10) encasing one or more semiconductor devices (30). The package (10) includes a dielectric substrate (12) having opposing first (14) and second (16) sides with a plurality of electrically conductive vias (18) and a centrally disposed aperture (20) extending from the first side (14) to the second side (16). A heat slug (22) has a mid portion (28) extending through the aperture (20), a first portion (24) adjacent the first side (14) of the substrate (12) with a cross sectional area larger than the cross sectional area of the aperture (20) and an opposing second portion (26) adjacent the second side (16) of the substrate (12). One or more semiconductor devices (30) are bonded to the first portion (24) of the heat slug (22) and electrically interconnected (32) to the electrically conductive vias (18). A heat spreader (34) having a first side (36) and an opposing second side (38) is spaced from the semiconductor devices (30) and generally parallel with the heat slug (22), whereby the semiconductor devices (30) are disposed between the heat spreader (34) and the heat slug (22). A molding resin (40) encapsulates the semiconductor devices (30) and at least the first side (14) of the substrate (12), the first portion (24) of the heat slug (22) and the first side (36) of the heat spreader (34).