SEMICONDUCTOR DEVICE HAVING PAD STRUCTURE WITH SHRUNKEN AREA

A semiconductor device for including the pad structure having the reduced area can overlap the connection part connecting the pad and the peripheral circuit section by using the pad and reduce the area of the pad structure. The pad(120) is arranged on the semiconductor substrate. The predetermined voltage is applied at the pad. The peripheral circuit section(150) controls the level of the applied voltage. The peripheral circuit section and pad are electrically connected by the connection part(170). The connection part is overlapped with the pad. The first well can be formed in the semiconductor substrate. The connection part can be overlapped between pad and the first well.