APPARATUS FOR REVERSING A SEMICONDUCTOR PACKAGE

An apparatus for reversing a semiconductor package is provided to improve the efficiency of a process by transferring a semiconductor packages to a next stage in regardless of each operation without delay. A first reversing unit(200) is connected to the first guide rail(202) so that it is movable. A second reversing unit(300) is connected to the second guide rail(302) so that it is movable. A first guide rail is extended according to a first line, and a second guide rail is extended with the first line according to second line parallel to the first line. The first and second guide rails are fixed to the outer frame of a reversing device(100). A semiconductor packages individually cut down through the sawing process are transferred by a picker(150) to the reversing device. A picker is moved to the reversing device according to a third guide rail(102). The first and second reversing unit transfers an overturned to inspect a first and second side of the semiconductor package.