TAPE STRUCTURE, AND METHOD AND APPARATUS FOR SEPARATING A WAFER USING THE SAME

A tape structure and method for releasing wafer using the same and apparatus are provided to make the accumulated charges between the tape structure and the objects neutralized through the ground of the neutralization layer. The objects is supported by the base layer(110). The neutralization layer(1...

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Bibliographische Detailangaben
Hauptverfasser:	JEON, JONG KEUN, CHOI, SOON JU, LEE, YONG JIN, LEE, CHANG HOON
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A tape structure and method for releasing wafer using the same and apparatus are provided to make the accumulated charges between the tape structure and the objects neutralized through the ground of the neutralization layer. The objects is supported by the base layer(110). The neutralization layer(120) is equipped on the base layer. The neutralization layer is earthed and makes the accumulated electric charge between the objects and the base layer neutralized. The bonding layer(130) is equipped on the neutralization layer. The objects is adhered to the bonding layer. The neutralization layer comprises the conductive metal. The thickness of the neutralization layer can be 10um to 30um.