METHOD MANUFACTURING OF MOSFET DEVICE
A manufacturing method of the MOSFET device is provided to suppress the diffusion of impurity by forming an ion implantation layer for the diffusion barrier at the lower part of the channel region. A manufacturing method of the MOSFET device injecting the ion within the semiconductor substrate inclu...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | KO, MIN GU |
description | A manufacturing method of the MOSFET device is provided to suppress the diffusion of impurity by forming an ion implantation layer for the diffusion barrier at the lower part of the channel region. A manufacturing method of the MOSFET device injecting the ion within the semiconductor substrate includes the step for ion-implanting the P- type impurity into the semiconductor substrate in order to form a channel region(240) in a semiconductor substrate(200); the step for ion-implanting either an oxide or a nitride into the semiconductor substrate in which the channel region is formed in order to form an ion implantation layer(250) for the diffusion barrier at the lower part of the channel region. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20090026596A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20090026596A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20090026596A3</originalsourceid><addsrcrecordid>eNrjZFD1dQ3x8HdR8HX0C3VzdA4JDfL0c1fwd1Pw9Q92cw1RcHEN83R25WFgTUvMKU7lhdLcDMpASWcP3dSC_PjU4oLE5NS81JJ47yAjAwNLAwMjM1NLM0dj4lQBACc2JB4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD MANUFACTURING OF MOSFET DEVICE</title><source>esp@cenet</source><creator>KO, MIN GU</creator><creatorcontrib>KO, MIN GU</creatorcontrib><description>A manufacturing method of the MOSFET device is provided to suppress the diffusion of impurity by forming an ion implantation layer for the diffusion barrier at the lower part of the channel region. A manufacturing method of the MOSFET device injecting the ion within the semiconductor substrate includes the step for ion-implanting the P- type impurity into the semiconductor substrate in order to form a channel region(240) in a semiconductor substrate(200); the step for ion-implanting either an oxide or a nitride into the semiconductor substrate in which the channel region is formed in order to form an ion implantation layer(250) for the diffusion barrier at the lower part of the channel region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090313&DB=EPODOC&CC=KR&NR=20090026596A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090313&DB=EPODOC&CC=KR&NR=20090026596A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO, MIN GU</creatorcontrib><title>METHOD MANUFACTURING OF MOSFET DEVICE</title><description>A manufacturing method of the MOSFET device is provided to suppress the diffusion of impurity by forming an ion implantation layer for the diffusion barrier at the lower part of the channel region. A manufacturing method of the MOSFET device injecting the ion within the semiconductor substrate includes the step for ion-implanting the P- type impurity into the semiconductor substrate in order to form a channel region(240) in a semiconductor substrate(200); the step for ion-implanting either an oxide or a nitride into the semiconductor substrate in which the channel region is formed in order to form an ion implantation layer(250) for the diffusion barrier at the lower part of the channel region.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1dQ3x8HdR8HX0C3VzdA4JDfL0c1fwd1Pw9Q92cw1RcHEN83R25WFgTUvMKU7lhdLcDMpASWcP3dSC_PjU4oLE5NS81JJ47yAjAwNLAwMjM1NLM0dj4lQBACc2JB4</recordid><startdate>20090313</startdate><enddate>20090313</enddate><creator>KO, MIN GU</creator><scope>EVB</scope></search><sort><creationdate>20090313</creationdate><title>METHOD MANUFACTURING OF MOSFET DEVICE</title><author>KO, MIN GU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20090026596A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KO, MIN GU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO, MIN GU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD MANUFACTURING OF MOSFET DEVICE</title><date>2009-03-13</date><risdate>2009</risdate><abstract>A manufacturing method of the MOSFET device is provided to suppress the diffusion of impurity by forming an ion implantation layer for the diffusion barrier at the lower part of the channel region. A manufacturing method of the MOSFET device injecting the ion within the semiconductor substrate includes the step for ion-implanting the P- type impurity into the semiconductor substrate in order to form a channel region(240) in a semiconductor substrate(200); the step for ion-implanting either an oxide or a nitride into the semiconductor substrate in which the channel region is formed in order to form an ion implantation layer(250) for the diffusion barrier at the lower part of the channel region.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_KR20090026596A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | METHOD MANUFACTURING OF MOSFET DEVICE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T14%3A59%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KO,%20MIN%20GU&rft.date=2009-03-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20090026596A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |