POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME

A polyimide film that in the stacking of multilayered substrates by means of a hot press, reduces any inter-film adhesion at hinge portion, excelling in easily sliding property enabling resolution of the "squeak" trouble caused by mutual friction of films. There is provided a polyimide fil...

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Bibliographische Detailangaben
Hauptverfasser: SAWASAKI KOICHI, TESHIBA TOSHIHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A polyimide film that in the stacking of multilayered substrates by means of a hot press, reduces any inter-film adhesion at hinge portion, excelling in easily sliding property enabling resolution of the "squeak" trouble caused by mutual friction of films. There is provided a polyimide film having a streaked unevenness on the surface thereof and exhibiting a coefficient of static friction between film surfaces of 0.1 to 0.7, preferably having a film surface roughness (Rz) of 0.7 to 10 mum. Further, there is provided a process for producing a polyimide film, comprising subjecting a surface of polyimide film to abrasion treatment by means of a grinding roll or grinding tape to thereby form a streaked unevenness on the surface thereof.