METHOD FOR COMPRESSION MOLDING ELECTRIC COMPONENT AND COMPRESSION MOLDING APPARATUS FOR USE IN THE METHOD

A horizontal nozzle (23) is first inserted in a horizontally extended state into between an upper mold (6) and a lower mold (7).A liquid resin (4) is then delivered in a horizontal direction through a delivery port (29) in the horizontal nozzle (23) and thus is supplied into a cavity (10). Thereafte...

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Bibliographische Detailangaben
Hauptverfasser:	GOTOH TOMOYUKI, YAMADA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A horizontal nozzle (23) is first inserted in a horizontally extended state into between an upper mold (6) and a lower mold (7).A liquid resin (4) is then delivered in a horizontal direction through a delivery port (29) in the horizontal nozzle (23) and thus is supplied into a cavity (10). Thereafter, the mold assembly of the upper mold (6) and the lower mold (7) is closed. As a result, an electric component (2) mounted on a substrate (1) is immersed in the liquid resin (4) in the cavity (10), and, thus, the electric component (2) is resin sealed on the substrate (1) by compression molding.