LAMINATING APPARATUS AND METHOD OF LAMINATING THEREWITH

The apparatus is equipped with vacuum laminating unit (2) furnished with a pair of heat discs (23,26) opposed to each other, at least one of these heat discs (23,26) capable of advancing forward and backward relative to the other. There is provided a laminating apparatus adapted to superimpose a fil...

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Bibliographische Detailangaben
Hauptverfasser:	YASUMOTO RYOICHI, IWATA KAZUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRESSES PRESSES IN GENERAL PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The apparatus is equipped with vacuum laminating unit (2) furnished with a pair of heat discs (23,26) opposed to each other, at least one of these heat discs (23,26) capable of advancing forward and backward relative to the other. There is provided a laminating apparatus adapted to superimpose a film resin material on base material (8a) having at least one of its front and back surfaces furnished with unevenness on the uneven surface by the use of the vacuum laminating unit(2) to thereby form laminate (9), wherein elastic press plate (24(27)) brought into contact with the surface of the film resin material (8b) and pressing the same is disposed on the side of film resin material of the heat disc (23(26)) opposed to the film resin material. Accordingly, even when the unevenness interspace of the base material (8a) is minute, close follow of film resin layer on the base material (8a) can be attained so as to avoid any remaining of bubbles between the base material (8a) and the film resin layer.