STACK TYPE MEMORY MODULE AND ITS MANUFACTURING METHOD

A stack type memory module and its manufacturing method is provided to realize high integration memory module by using the connection part to be bent and laminating extension unit on the body. A laminated memory module(100) includes a body in which a memory is mounted at the substrate(105) and a fle...

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Bibliographische Detailangaben
Hauptverfasser:	BANG, HYO JAE, HAN, SEONG CHAN, SHIN, DONG WOO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A stack type memory module and its manufacturing method is provided to realize high integration memory module by using the connection part to be bent and laminating extension unit on the body. A laminated memory module(100) includes a body in which a memory is mounted at the substrate(105) and a flexible(Flexible) connection unit(102). Extension units(103,104) are connected to the body through the flexible connection part and has the additional memory mounted on the substrate. A plurality of memories is mounted on front side and backplane of the body, which has a connection terminal in lower part.