PHOTORESIST STRIPPER COMPOSITION AND EXFOLIATION METHOD OF A PHOTORESIST USING THE SAME

A photoresist stripper composition, and a method for stripping photoresist by using the composition are provided to remove the cured or modified photoresist and photoresist residue effectively, thereby preventing the corrosion of a metal layer and an insulating layer. A photoresist stripper composit...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HONG, HYUNG PYO, HONG, HUN PYO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A photoresist stripper composition, and a method for stripping photoresist by using the composition are provided to remove the cured or modified photoresist and photoresist residue effectively, thereby preventing the corrosion of a metal layer and an insulating layer. A photoresist stripper composition comprises 0.1-30 wt% of an organic sulfonic acid compound; 0.1-30 wt% of a phosphoric acid compound; and the balance of water. Preferably the organic sulfonic acid compound is at least one selected from the group consisting of a C1-C4 alkyl sulfonic acid, a C6-C8 aryl sulfonic acid, a C5-C7 heteroaryl sulfonic acid and a C1-C12 alkyl benzenesulfonic acid.