UNIT FOR TRANSFERRING A SUBSTRATE AND APPARATUS FOR BONDING DIES HAVING THE UNIT

A substrate transportation unit and a die bonding apparatus having the same are provided to improve the bonding accuracy of a die by accurately detecting the defect mark of a printed circuit board as the printed circuit board is planar by vacuum force. A substrate transportation unit comprises a rai...

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Bibliographische Detailangaben
1. Verfasser:	MUN, GANG HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate transportation unit and a die bonding apparatus having the same are provided to improve the bonding accuracy of a die by accurately detecting the defect mark of a printed circuit board as the printed circuit board is planar by vacuum force. A substrate transportation unit comprises a rail(110), a vacuum providing part(120), and a pair of covers(130). The rail guides the movement of a printed circuit board. The rail has a plurality of vacuum holes on the upper side of the rail. The vacuum providing part provides vacuum pressure to vacuum holes in order to absorb the printed circuit board to the upper side of the rail. In order to prevent the deformation of the printed circuit board, the covers are separated on the rail with an interval.