APPARATUS AND METHOD FOR POLISHING WAFER BACKSIDE

A method and an apparatus for polishing wafer backside are provided to ensure the quality of wafer by partly polishing the detected defect of wafer backside secondarily. A method for polishing wafer backside comprises a step of polishing the backside of a wafer first in order to remove a defect of t...

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Bibliographische Detailangaben
1. Verfasser:	PARK, PIL GYU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A method and an apparatus for polishing wafer backside are provided to ensure the quality of wafer by partly polishing the detected defect of wafer backside secondarily. A method for polishing wafer backside comprises a step of polishing the backside of a wafer first in order to remove a defect of the wafer backside in which the grinding for reducing the thickness is completed(S20), a step of obtaining an image of the wafer backside in which the first polishing is made(S30), a step of confirming the state of the wafer backside from the obtained image(S40), and a step of, if defect is remained on the backside of the wafer after first polishing, performing second polishing of the defect area(S60).