UNIT FOR LOADING A SUBSTRATE AND APPARATUS FOR BONDING DIES HAVING THE UNIT

A die bonding apparatus having a substrate loading unit is provided to minimize installation space since a substrate loading unit is positioned in the same direction as rail by a loading container as a standard. A substrate loading unit(100) comprises a body(110), a vacuum providing part(120), and a...

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Bibliographische Detailangaben
1. Verfasser:	MUN, GANG HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A die bonding apparatus having a substrate loading unit is provided to minimize installation space since a substrate loading unit is positioned in the same direction as rail by a loading container as a standard. A substrate loading unit(100) comprises a body(110), a vacuum providing part(120), and a driving part(130). The body has a plurality of vacuum holes(112) on a contact surface(110a) contacted to the side of the substrate. The vacuum providing part provides vacuum force to vacuum holes so that the substrate is absorbed to the body. The driving part makes the body in linear reciprocating motion toward a direction parallel to the substrate.