METHOD AND APPARATUS FOR MATCHING DEFECT DISTRIBUTION PATTERN

A matching apparatus is provided with a defect inspecting section (72), a reference pattern storage section (74), a pattern matching section (76), a matching result processing section (78) and an output section (80). The inspecting section (72) inspects subjects processed by a processing system, such as a semiconductor wafer, and obtains the distribution pattern of defects generated on the surface. The storage section (74) previously stores a reference pattern indicating a characteristic pattern of a specific portion which is in contact with or close to the subject in the processing system. The matching section (76) matches the defect distribution pattern obtained by the inspecting section (72) with the reference pattern stored in the storage section (74). The matching result processing section (78) obtains degree of matching of the both patterns, based on the matching performed by the matching section (76). The output section (80) outputs the obtained degree of matching through a display (80A) or the like. ® KIPO & WIPO 2009