PROCESS FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD OBTAINED BY THE PROCESS

A process for manufacturing a circuit board having a circuit chip embedded resin sheet consisting of a resin sheet embedded with circuit chips, comprising the steps of (a) arranging and fixing circuit chips on a processing substrate; (b) applying a liquid energy-hardening resin sheet forming material onto the processing substrate with the circuit chips arranged and fixed to thereby form an unhardened coating layer; (c) applying energy to the unhardened coating layer so as to harden the same, thereby forming a circuit chip embedded resin sheet layer; and (d) detaching the processing substrate from the circuit chip embedded resin sheet layer.Further, there is provided a circuit board obtained by the process. Accordingly, a circuit board having a resin sheet embedded with circuit chips for controlling of each of pixels for display, etc. can be efficiently produced with high quality at high productivity. ® KIPO & WIPO 2009