SEMICONDUCTOR DEVICE

A semiconductor device is provided to prevent the crack due to the thermal stress and the exfoliation by including the ceramic substrate having the first face in which the semiconductor device is coupled and the second face in which radiator is coupled. A semiconductor device comprises the ceramic s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKAGAWA SHINTARO, SUZUYAMA TAKESHI, NISHI SHINSUKE, ICHIYANAGI SHIGEHARU, MORI SHOGO, WATANABE SHINTARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device is provided to prevent the crack due to the thermal stress and the exfoliation by including the ceramic substrate having the first face in which the semiconductor device is coupled and the second face in which radiator is coupled. A semiconductor device comprises the ceramic substrate(14) having the first face and the second face which is the opposite side of the first face; the semiconductor device(12) coupled in the first face; the radiator coupled in the second face; the interposer(19) provided between the second face and the radiator. The interposer includes the plurality of coupling regions for coupling the second face to the radiator; the plurality of non-coupling regions for not coupling the second face to the radiator.