AG ALLOY TARGET, AG ALLOY SPUTTERING TARGET AND AG ALLOY THIN FILM FOR THE ELECTROMAGNETIC INTERFERENCE SHIELDING

An Ag alloy thin film with superior heat resistance, corrosion resistance and cohesive power for the electromagnetic interference shielding is required as the material for the electromagnetic interference shielding, and the corrosion resistance and cohesive power are provided. Ag alloy target for th...

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Bibliographische Detailangaben
Hauptverfasser:	YANG, SEUNG HO, HONG, GIL SU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An Ag alloy thin film with superior heat resistance, corrosion resistance and cohesive power for the electromagnetic interference shielding is required as the material for the electromagnetic interference shielding, and the corrosion resistance and cohesive power are provided. Ag alloy target for the electromagnetic interference shielding comprise at least one element selected in the lanthanide consisting of the pr, nd, eu, dy and Er and Cu and Ag. The sum total selected in the crowd of the lanthanide consisting of the pr, nd, eu, dy and Er of element more than the first class added amount of the metal element is 0.05~3.5wt%, Cu 0.05~3.5wt%, remnant is Ag.