MANUFACTURING METHOD OF PACKAGE FOR LIGHT EMITTING DIODE

The light emitting device for implementing the light of the various optical spectrum or the color temperature by forming a plurality of lighting-emitting areas within one package, is provided. Provided is the manufacturing method of the package for the light emitting diode. A groove is dug in the gr...

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Bibliographische Detailangaben
Hauptverfasser:	NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The light emitting device for implementing the light of the various optical spectrum or the color temperature by forming a plurality of lighting-emitting areas within one package, is provided. Provided is the manufacturing method of the package for the light emitting diode. A groove is dug in the green sheet and an electrode(18) is formed by sintering the basic body. A cover body(5) of ceramic is formed by sintering the green sheet. A plurality of the cover bodies is stick to the basic body. The basic body is cut according to each cover by using the groove.