PREPREG, MULTILAYER WIRING BOARD AND ELECTRONIC PARTS USING SAME

PREPREG, MULTILAYER WIRING BOARD AND ELECTRONIC PARTS USING SAME

A prepreg and a circuit board and electronic part using the same are provided to enable a printed circuit board, multi layer print circuit board, and a flexible circuit board to have good processing property, low dissipation factor, and excellent heat resistance. A prepreg comprises: a resin composi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: AMOU SATORU, SHIMIZU HIROSHI, HANAWA AKINORI
Format: Patent
Sprache:eng
Schlagworte:
MAKING GRANULES OR PREFORMS
PERFORMING OPERATIONS
PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED
RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:A prepreg and a circuit board and electronic part using the same are provided to enable a printed circuit board, multi layer print circuit board, and a flexible circuit board to have good processing property, low dissipation factor, and excellent heat resistance. A prepreg comprises: a resin composite A having thermal curing property and at least less than 0.005 of dissipation factor at 1 GHz after curing, including multifunctional styrene compound, polybutadiene compound and a curing catalyzer, bismaleimide, and silane coupling agent; a base material B including polyolefin fiber C and fiber D including glass fiber with higher tensile strength and lower thermal expansion rate than that of polyolefin fiber, which is a cloth with less than 5 wt% of elution rate into hydrocarbon organic solvent.