APPARATUS AND METHOD FOR SOLDERING FLAT WORK PIECE

A soldering apparatus including a vessel (109) containing a molten solder, a casing (106) defining therewithin a soldering chamber (106c) in which a flat overflowing wave of the molten solder is formed, a conveyor (107) physically integrated with the casing (106) for movement therewith and operable...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ARITA MASATO, IKEDO KENSHI, OKUNO AKIRA, AOYAMA NOBUYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A soldering apparatus including a vessel (109) containing a molten solder, a casing (106) defining therewithin a soldering chamber (106c) in which a flat overflowing wave of the molten solder is formed, a conveyor (107) physically integrated with the casing (106) for movement therewith and operable for transferring a printed circuit board (3) through the soldering chamber (106c), actuators (118) and (119) for vertically moving the casing (106), inert gas feeders (114a) for feeding an inert gas to the soldering chamber (106c), and a controller for controlling the operation of the actuators (118) and (119), so that the printed circuit board (3) is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber (106c).