PCB WITH METAL CORE AND METHOD FOR FABRICAITON OF THE SAME AND METHOD FOR FABRICATION OF SEMICONDUCTOR PACKAGE USING PCB WITH METAL CORE

PCB WITH METAL CORE AND METHOD FOR FABRICAITON OF THE SAME AND METHOD FOR FABRICATION OF SEMICONDUCTOR PACKAGE USING PCB WITH METAL CORE

A PCB(Printed Circuit Board) with a metal core, a method for fabricating the same, and a method for fabricating a semiconductor package using the PCB with the metal core are provided to reduce a cost by not performing a prepreg forming process. A method for fabricating a PCB includes the steps of: s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KO, JUN YOUNG, JEON, JONG KEUN, SIN, WHA SU, CHAN, DAE SANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A PCB(Printed Circuit Board) with a metal core, a method for fabricating the same, and a method for fabricating a semiconductor package using the PCB with the metal core are provided to reduce a cost by not performing a prepreg forming process. A method for fabricating a PCB includes the steps of: supplying a metal core(10); bonding a copper foil to the metal core; and patterning a PCB circuit by etching the copper foil bonded to the metal core. The method further includes the steps of coating the copper foil with an adhesive(20) to bond the copper foil to the metal core and processing a slot passing through the metal core and the copper foil after patterning the PCB circuit.