THE HEAT MELT JIG

A thermal bonding machine for a cell phone case is provided to reduce a tolerance range caused by moving a pressing plate and pressing pins vertically and adjust the height easily base on the shape of moldings to be bonded. A thermal bonding machine for a cell phone case comprises a body part, a pre...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, KYU CHIL, HWANG, YONG SU, KIM, SUNG HWAN, CHOI, DONG HEE, LEE, HAK JIN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A thermal bonding machine for a cell phone case is provided to reduce a tolerance range caused by moving a pressing plate and pressing pins vertically and adjust the height easily base on the shape of moldings to be bonded. A thermal bonding machine for a cell phone case comprises a body part, a pressing part, and a metallic jig(300). The body part is formed with a plate shaped base(110), a guide rod(120) having a spring(121) and standing-installed at one side of the base, and a linear guide(130) standing on the other side of the base and installed with a guide block. The pressing part is installed with a horizontal plate(230) combined with the body part, installed with a pressing plate(210) which is detachable from the horizontal plate, and mounted with a fixing plate(250) having a pin fixing plate(240) and heating rods(252) between the horizontal plate and the pressing plate, and pressing pins(251) sequentially. The jig is placed on the base to reduce a tolerance range and minimize a defective rate.