PRINTED WIRING BOARD WITH BULLT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME

This invention provides a printed wiring board with a built-in semiconductor element that has excellent adhesion to an overlying wiring board without being adversely influenced by unsatisfactory sealing material packing or excessive sealing material packing. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, upper surface, or side surface thereof is covered with an insulating film, and an insulating layer is provided on the side and upper part of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, upper surface or side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet on the side of the semiconductor element, and disposing and stacking a semicured insulating sheet on the upper part of the semiconductor element.