SEMICONDUCTOR PACKAGE
A semiconductor package is provided to prevent warpage of the semiconductor package caused by thermal stress by forming a fence on a substrate and covering the substrate including a semiconductor chip and the fence with an encapsulation material. A semiconductor package comprises a substrate(100), a...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor package is provided to prevent warpage of the semiconductor package caused by thermal stress by forming a fence on a substrate and covering the substrate including a semiconductor chip and the fence with an encapsulation material. A semiconductor package comprises a substrate(100), a semiconductor chip(140), a fence(130), an encapsulation material(160). The semiconductor chip is formed on the substrate. The fence contacts the substrate, and surrounds the semiconductor chip. The encapsulation material is formed on the substrate including the semiconductor chip and the fence. Bonding wires(150) connect the semiconductor chip with the substrate electrically. The fence surrounds the semiconductor chip and the bonding wires laterally. |
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