A AMENDING SYSTEM OF THE SEMIICONDUCTOR PACKAGE POSITIONING AND A AMENDING METHOD THEREOF

A correction system for semiconductor package position and a correction method thereof are provided to prevent interruption of a semiconductor package process and to enhance process efficiency by correcting a position of the semiconductor package. A semiconductor package is loaded on an upper surfac...

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1. Verfasser: JUNG, HYUN GYUN
Format: Patent
Sprache:eng
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Zusammenfassung:A correction system for semiconductor package position and a correction method thereof are provided to prevent interruption of a semiconductor package process and to enhance process efficiency by correcting a position of the semiconductor package. A semiconductor package is loaded on an upper surface of a table. A picker(112) picks up the semiconductor package loaded on the table. An inspection unit detects a deviation of the semiconductor package from a normal position. A pad part of a rectangle is formed at a front end of the picker so that the deviation of the semiconductor package from the normal position to an X-axis direction, a Y-axis direction, and a theta direction is detected by comparing the pad part and the semiconductor package with each other.