WAFER GRINDING APPARATUS AND WAFER GRINDING WHEEL

A wafer grinding apparatus and a wafer grinding wheel are provided to improve a flatness of a wafer by arranging plural wheel blades, which are ring shape, on the grinding wheel. When a wafer is loaded, a chuck table(10) sucks the wafer(12) and rotates the wafer at a constant speed. A spindle assemb...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOO, TAE HYOUNG, JU, HYUN HEE, CHOI, SOO YEOL, CHA, HYE JIN, KIM, HEE SUNG, HAN, SHIN HYEOK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A wafer grinding apparatus and a wafer grinding wheel are provided to improve a flatness of a wafer by arranging plural wheel blades, which are ring shape, on the grinding wheel. When a wafer is loaded, a chuck table(10) sucks the wafer(12) and rotates the wafer at a constant speed. A spindle assembly(20) is separated from the chuck table in an upward direction and selectively rotated or lowered, such that the wafer is ground. The spindle assembly includes a driving unit(22) and a grinding wheel(24). The driving unit lowers the spindle assembly, such that the spindle assembly is contacted with the wafer. The grinding wheel grinds the wafer to a predetermined thickness. The grinding wheel includes a wheel body, a first wheel blade, and a second wheel blade. The first wheel blade is arranged along an edge portion of the wheel body in a circular shape. The second wheel blade is arranged to be apart from the first wheel blade in an inward direction.