SOLDER PASTES COMPRISING NONRESINOUS FLUXES

The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down. The inventive gel is based on a mixture of carboxylic acid/s, amine/s, and solvent/s, said mixture being s...

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Bibliographische Detailangaben
Hauptverfasser:	TRODLER JOERG, LOOSZ CHRISTIAN, KREBS THOMAS, BREER FRANK, HORNUNG JUERGEN, SCHMITT WOLFGANG
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM WORKING-UP
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