SOLDER PASTES COMPRISING NONRESINOUS FLUXES

The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down. The inventive gel is based on a mixture of carboxylic acid/s, amine/s, and solvent/s, said mixture being s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TRODLER JOERG, LOOSZ CHRISTIAN, KREBS THOMAS, BREER FRANK, HORNUNG JUERGEN, SCHMITT WOLFGANG
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down. The inventive gel is based on a mixture of carboxylic acid/s, amine/s, and solvent/s, said mixture being stable during storage. Major uses include applying soft solder pastes to power modules, die attach, chip on board, system in package (SiP), wafer bumping, particularly under-bump metallization (UBM) and surface-mounted technology (SMT), especially lacquered circuits. Using nonresinous soft solder pastes makes it possible to dispense with the need to perform a cleaning process before applying a protective lacquer after soldering an electrical connection while the formation of pores in solder bumps applied to UBMs is reduced to less than 20 percent by volume.