APPARATUS FOR WET ETCHING AND ETCHING METHOD USING THE SAME

A wet etching apparatus is provided to make injected etchant flow downward without staying on a substrate by transferring the substrate while the substrate is erect. A substrate transfer unit(10) transfers a substrate(S) while the substrate is erect with respect to the ground. An etchant injection u...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, KWANG BOK, CHO, TAE HEON, KO, KYOUNG WAN, LIM, JONG TAE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A wet etching apparatus is provided to make injected etchant flow downward without staying on a substrate by transferring the substrate while the substrate is erect. A substrate transfer unit(10) transfers a substrate(S) while the substrate is erect with respect to the ground. An etchant injection unit(20) injects etchant to the surface of the erect substrate. The etchant injection unit can include a nozzle pipe(21) for transferring supplied etchant toward the substrate and at least one nozzle(22) formed on the outer surface of the nozzle pipe to face the substrate, wherein at least one nozzle pipe is formed on the front and back surfaces of the substrate.